Pipmed Medical
| Model NO. | Non-Standard Manufacturing |
| Control | Automatic |
| Application | Electrical & Electronics Industry, Lighting Industry, Auto Industry, Communication Industry |
| Certification | ISO |
| Laser Power | 100W / 150W / 200W (Selectable) |
| Laser Wavelength | 1064nm |
| Cooling Mode | Full Air-Cooled |
| Package Size | 110.00cm * 100.00cm * 180.00cm |
| Gross Weight | 800.000kg |
| Origin | China |
This Laser Tin Ball Soldering Machine is a cutting-edge solution for high-precision soldering applications. Designed for microelectronic components, it combines advanced fiber laser technology with a dual-station interactive feeding system to maximize efficiency and accuracy. Ideal for BGA chips, 5G optical communication devices, camera modules, and semiconductor packaging, this machine ensures spatter-free, residue-free welding with pinpoint consistency.



| Parameter | Specification |
|---|---|
| Laser Power | 100W / 150W / 200W (selectable) |
| Laser Wavelength | 1064nm |
| Cooling Mode | Full air-cooled |
| Tin Ball Diameter | 60-2000μm |
| Control System | PC + dedicated software |
| Positioning Mode | CCD vision system |
| Repeat Accuracy | ±3μm / ±5um / ±0.02mm |
| Soldering Range | 200 × 200mm |
| Processing Speed | ≈3 balls/second |
| Power Supply | AC220V, 50Hz |

High-definition CCD camera with a full-vision image positioning system, offering 360° intelligent recognition and positioning. Automatically captures custom welding paths, adaptable to various shapes, with arbitrary programming of X-Y-Z motion trajectories.
Utilizes a fiber laser module and high-precision temperature feedback control system, enabling temperature control in tiny areas (0.3-1.5mm diameter) with ±10°C accuracy, ensuring optimal welding results and preventing workpiece damage.


Features an efficient and precise dual-Y structure worktable with ±7μm motion repeat accuracy, ensuring stability and consistency in batch production through precise motion control.
High-precision solder ball placement mechanism, controlled via program settings and nozzle selection, manages the rate and amount of solder balls to precisely control solder joint size.

Main Applications: IT electronics, digital industry, PCB socket components, optoelectronic products, sensors, mobile phones, digital cameras, camera modules, and other high-precision component welding.
Specific Uses: Coil soldering, socket component soldering, connector bases, medical cameras, and camera modules.




Our company is a National High-tech Enterprise with ISO 9001 certification, integrating R&D expertise and 86 patented technologies. Our equipment guarantees ±0.01mm welding precision, meeting the demands of miniaturized, high-density electronics. We provide comprehensive technical support and after-sales response, including parameter debugging and process training.